Electronic Package Design: Integration in Materials

Objectives:

Design future packaging solutions for optimal integration of distributed electronic sensor systems into both materials and smart objects

  • 3-D (bulk materials and components) and 2-D (laminate materials and low profile components) under investigation
  • Simulation and experimental studies will discover guidelines for optimal package design: choice of package shape and dimensions
  • Minimising the detrimental effects on host materials by introduction of “soft” buffers around electronic package